![Figure 1 from A comparison of thermal vias patterns used for thermal management in power converter | Semantic Scholar Figure 1 from A comparison of thermal vias patterns used for thermal management in power converter | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/d63bb6d79ab2a9298770ebb5fa9807ace7717b3f/1-Figure1-1.png)
Figure 1 from A comparison of thermal vias patterns used for thermal management in power converter | Semantic Scholar
![Aavid Thermalloy has announced the new Slalom heatsink (patent pending) suitable for SMT power semiconductor devices in D2PAK packages. Aavid Thermalloy has announced the new Slalom heatsink (patent pending) suitable for SMT power semiconductor devices in D2PAK packages.](https://www.anglia.com/newsarchive/images/2373.jpg)
Aavid Thermalloy has announced the new Slalom heatsink (patent pending) suitable for SMT power semiconductor devices in D2PAK packages.
![FK 244 08 D2 PAK | Fischer Elektronik Heat Sink D-PAK (TO-252)/D2-PAK (TO-263)/D3-PAK (TO-268)/SO-8/SO-14/SO-16/Power SO-10/SOT-223 29.3 K/W | Distrelec Germany FK 244 08 D2 PAK | Fischer Elektronik Heat Sink D-PAK (TO-252)/D2-PAK (TO-263)/D3-PAK (TO-268)/SO-8/SO-14/SO-16/Power SO-10/SOT-223 29.3 K/W | Distrelec Germany](https://media.distrelec.com/Web/WebShopImages/landscape_large/_t/if/ick-smd-f-4.jpg)
FK 244 08 D2 PAK | Fischer Elektronik Heat Sink D-PAK (TO-252)/D2-PAK (TO-263)/D3-PAK (TO-268)/SO-8/SO-14/SO-16/Power SO-10/SOT-223 29.3 K/W | Distrelec Germany
![FK24413D2PAK FISCHER ELEKTRONIK - Disipador: prensados | D2PAK,TO263; L: 13mm; W: 26mm; H: 10mm; 22,8K/W | TME - Elektroniikka komponentit FK24413D2PAK FISCHER ELEKTRONIK - Disipador: prensados | D2PAK,TO263; L: 13mm; W: 26mm; H: 10mm; 22,8K/W | TME - Elektroniikka komponentit](https://ce8dc832c.cloudimg.io/v7/_cdn_/C2/5D/50/00/0/382252_1.jpg?width=640&height=480&wat=1&wat_url=_tme-wrk_%2Ftme_new.png&wat_scale=100p&ci_sign=1509f11e8fb6c5b0598a0ff98ee98a49db6d3a59)
FK24413D2PAK FISCHER ELEKTRONIK - Disipador: prensados | D2PAK,TO263; L: 13mm; W: 26mm; H: 10mm; 22,8K/W | TME - Elektroniikka komponentit
![heatsink - Optimize heat sink design - connect cooling pad on PCB backside by vias - Electrical Engineering Stack Exchange heatsink - Optimize heat sink design - connect cooling pad on PCB backside by vias - Electrical Engineering Stack Exchange](https://i.stack.imgur.com/4QJEq.gif)
heatsink - Optimize heat sink design - connect cooling pad on PCB backside by vias - Electrical Engineering Stack Exchange
![pcb design - Heatsink land pattern interpretation (DPAK heatsink) - Electrical Engineering Stack Exchange pcb design - Heatsink land pattern interpretation (DPAK heatsink) - Electrical Engineering Stack Exchange](https://i.stack.imgur.com/3S5xk.png)